RF & Microwave

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Videos

Avago Demo Video at MTT
Short WiFi WiMax RF Front End Demo from MTT 2010
Courtesy Microwave Journal

New RF WiMAX Front End Solution How-to Video
Designers of mobile WiMAX/WiBRO systems face many challenges when designing and specifying the RF front end. Avago has addressed these concerns with a new solution that consists of three separate small standalone modules. Watch the video...

Revolutionary New Chip Scale Packaging Flash Demo
This flash shows a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago's innovative WaferCap is the industry's first semiconductor-based chip scale packaging (CSP) technology. The ultra small product dimensions and performance levels resulting from WaferCap CSP provide a new level of design flexibility in device placement that will change the way RF designers think about a variety of wireless product designs.

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Front End Modules

Avago offers highly reliable and integrated multi-chip front-end module solutions that will reduce parts count, board space, and cost and shorten design cycle time by integrating various critical RF front-end elements into a single partially matched or fully matched device.

Avago Technologies CDMA front end modules offer premium performance in a small form factor. They are designed using CoolPAM Power Amplifiers integrated with FBAR filters.

Power modules offer extended talk time and excellent linearity by using CoolPAMTM technology which enhances efficiencies in low and medium power mode. These devices meet stringent CDMA linearity requirements.

Within these front end modules products, FBAR (Film Bulk Acoustic Resonator) based duplexers provide low insertion loss and outstanding isolation, which improves efficiency and RX sensitivity.

Click here for help selecting an Avago RF solution or to request samples

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